MicroForging can produce fins of almost any shape. This includes elliptical and hexagonal fins,
well suited for passive and active applications. Dense and sparse patterns can be forged,
allowing the optimal pattern to be created. Our patented copper embedding process provides
significant improvement if the heat source size is small and the power dissipation is high.
Significant product data can be downloaded from our online catalog, including performance data, drawing/CAD files,
price/delivery, RoHS/REACH, etc.. If this is not sufficient, we will quickly respond to all questions both technical and order related.
Our extensive selection of attachment hardware allows customers to easily tailor a heat sink to a specific
application. This includes mounting method, attachment force, board real estate limitations, etc..
Our Anchor Pins only require 1.80mm diameter holes in the PCB. This is the smallest footprint
of any mechanical attachment method that transfers the attachment forces directly to the PCB.