Online Catalog

Comparison of Temperature Trends between the Vapor Chamber (VC120) and a Copper Plate.

Vapor Chamber

(Above picture shows Vapor Chamber cross section)

The inner wall of the thin copper container is bonded with a copper mesh, and a porous wick is placed at the heat source. The working fluid, pure water sealed under vacuum conditions, continuously evaporates and condenses, circulating through the wick by capillary action, efficiently dissipating heat.

The video on the left shows the temperature distribution when a 15x25mm heater is in contact with a product of 120mm square and 3mm thickness.
Compared to copper, the vapor chamber (VC120)
maintains a more uniform temperature over
a wider area, effectively suppressing
the temperature rise at
the heat source.

If the shape or size does not meet your requirements, please contact our sales department.

Model	Size W x L (mm)	Corner R (mm)	Hole Pitch X x Y (mm)	Hole Dia ⌀H	Weight (g)
VC80	80 x 80	2.8	70 x 70	5.5	87.3
VC90	90 x 90	80 x 80	114.3
VC100	100 x 100	90 x 90	142.5
VC120	120 x 120	110 x 110	203.4
VC106x70	106 x 70	96 x 60	5.9	101.1
VC60-H	60 x 60	10	49 x 49	2.8	49.1
VC70-H	70 x 70	59 x 59	68.2
VC80-H	80 x 80	69 x 69	87.2
VC90-H	90 x 90	79 x 79	114.2
VC100-H	100 x 100	89 x 89	142.4
VC120-H	120 x 120	109 x 109	203.3

Measurement setup 1 (Bare die / Water cooling)

A vapor chamber was placed on a heater with a thermocouple, and its top surface was cooled using a water-cooling block. The thermal resistance value was based on the temperature rise of the heater relative to the water inlet temperature. Thermal grease was applied at each interface.

Thermal resistance (°C/W) : (Tj - Tw) / Watts

Model	Power(W)
Model	100	200	400
VC80	0.094	0.088	0.08
VC90	0.079	0.074	0.069
VC100	TBD	TBD	TBD
VC120	0.078	0.073	0.066
VC106x70	0.091	0.086	0.077
Without Vapor Chamber	0.104	0.099	0.094

Heat source size : 15 x 25 (mm), Water flow rate 4.0 (L/min)

Measurement setup 2 (Bare die / Active fan)

A vapor chamber was placed on top of a heater with thermocouples attached, and its top surface was cooled by a heat sink with a fan. Thermal resistance value was based on the temperature rise due to the heater relative to the temperature of the incoming air from the top of the fan. Thermal grease was applied at each interface.

Thermal resistance (°C/W) : (Tj - Ta) / Watts

Model (Combination)			Power(W)
Heatsink	Vapor Chamber	Fan	55	100
^*1 FH10040A (Base 4mm thick, All Al)	VC90	M92P	0.404	0.384
^*2 FHC10040A (Al + Cu embedded)	-		0.494	0.489
^*3 FH10040A (All Al)	-		0.610	0.609

^*1 Custom FH10040A (Base thickness 4mm + VC 3mm = 7mm)

^*2 Standard FHC10040A (Base thickness 7mm)

^*3 Standard FH10040A (Base thickness 7mm)

Model (Combination)				Thermal Resistance
Heatsink	Vapor Chamber	TIM	Power	(°C/W)
^*1 LPD80-30B	VC60-H	TPCM5125	90	0.404
	VC70-H			0.376
	VC80-H			0.351
^*2 LPD80-30B	-	-		0.599
^*3 UB80-30B	VC60-H	TPCM5125	110	0.339
	VC70-H			0.296
	VC80-H			0.278
^*4 UB80-30B	-	-		0.520

Heat source size : 12 x 12 (mm)

Fan: AFB0812SH

^*1 Custom LPD80-30B (Base thickness 2mm + VC 3mm = 5mm)

^*2 Standard LPD80-30B (Base thickness 5mm)

^*3 Custom UB80-30B (Base thickness 2mm + VC 3mm = 5mm)

^*4 Standard UB80-30B (Base thickness 5mm)

Thermal resistance (°C/W) : (Tj - Ta) / Watts

Model (Combination)		Thermal Interfaces
Heatsink	Vapor Chamber	TPCM5125	^*3 YG6260	G751
^*1 FS12040W	VC60-H	0.260
	VC80-H	0.204
	VC90-H	0.185
	VC100-H	0.181	0.185	0.176
	VC120-H		0.173	0.166
^*2 FS12040W	-	0.432

Heat source size : 12 x 12 (mm)

Power : 120 W

^*1 Custom FS12040W (Base thickness 4mm + VC 3mm = 7mm)

^*2 Standard FS12040W (Base thickness 7mm)

^*3 Thermal Silicon Oil Compound