We would like to introduce our latest heat
sinks, the S-PAL8045 and S-PAL8055, designed
for AMD Socket A processors.
Some of the new features make these products ideal for the latest Socket A boards.
The S-PAL8045/55 does NOT require the 4 holes surrounding the socket for mounting. The heat sink mounts to a custom bracket (FLG462) attached directly to the socket. The new base shape accommodates the entire AMD keep-out area. With these two new design, the S-PAL8045/55 should be compatible with almost every socket A board available.
The new fin pattern design is based on the airflow within the heat sink. Visually, the outside pins are square, and inside pins are round. The intake cover of each S-PAL8045/55 is longer, preventing air from taking a short cut past the hottest portion of the pins. These changes have improved the airflow and thermal performance of the heat sinks.
We plan to begin shipping production quantities in the end of February. For detailed information, please visit our Online catalogue our Online Catalog - S-PAL8045/55 Series.
© 2007 Alpha Novatech, Inc.